Full Automatic Solder Paste Printer

❙ Introduction of SMT Printer
GT++ automatic tin paste printing press is a high-end model for SMThigh-end application
1. Drip cleaning system
Drip cleaning structure, effectively prevent the solvent tube blockage cause no solvent while cleaning and poor cleaning effect.
2. Total new squeegee blade structure design
Through sliding rail and air cylinder new pattern squeegee blade structure, increase movement stability and prolonging the service life.
3. Guide Rail positioning System
New pattern patented guide rail can detachable, programmable flexible side clamp, specific toFPC, PCBwarpage, perform a unique clamping plate device. Through software programming can automatically stretch out and draw back unaffected PCB thickness.
4. CCD digital camera system
Total new optical path system, uniform circular light and high brightness of coaxial light source. With both light source system, brightness can adjust to an infinite loop, allowing different mark point can be easily recognize(including uneven mark point) such as tin plating, copper plating, silver plating, hot air soldering, FPC and various types of differentPCB color.
5. High precision adjustable PCB thickness lift up platform
Advance design, compact structure, high reliability, Smooth and stable lift up/down platform, pin height automatically adjust by software control. Precisely realize different types of PCB thickness position height adjust.
6. New multi-function interface
Simplicity, Clearly understand, friendly user. Actual temperature and humidity monitor function.
❙ Specification of SMT Stencil Printer
Model | GT++ |
Machine Performance | |
Repeat Position Accuracy | ±10um@6o,CPK≥2.0 |
Print Accuracy | ±18um@6o,CPK≥2.0 |
NCP-CT(Cleaning and printing not included) | <7.5 sec |
HCP-CT(Cleaning and printing not included) | 18s/pcs |
Manufacturing process CT | 4min |
Wire switching CT | 2min |
Substrate processing parameter | |
Maximum boardsize | 510*510mm(Optional upgrade to:610*510mm) |
Minimum board size | 50*50mm |
Board thickness | 0.4~6mm |
Camera Mechanical range | 528*510mm |
Maximum board weight | 5kg |
Board edgeclearance | 2.5mm |
Board height | 23mm Over top pin |
Transport speed | 900±40mm |
(Max)Transport speed | Segmented control,1500mm/s(Max) |
Transportdirection | One stage transport rail One stage |
Transmission direction | Left to right |
Right to Left | |
In and out the same | |
Support System | Magnetic Pin |
Support Block | |
Patented over the top damping | |
Board damp | Automatic top camping |
Side camping | |
Adsorption function | |
Printing Parameters | |
Print Speed | 10~200mm/sec |
Print Pressure | 0.5-20Kg |
Print Mode | One/Twice |
Queegee Type | Rubber/SqueegeeBlade (angle 45/55/60 |
Snap-off | 0~20mm |
Snap-Speed | 0~20mm/sec |
The template frame size | 470*370mm~737*737mm |
Steel mesh positioning mode | Automatic Y orientation |
Cleaning Parameters | |
Cleaning System | Dry,Wet Vacuum three modes |
High speed cleaning | Integrated &weave cleaning |
Cleaning system | Side spraytype |
Cleaning stroke | Automatic generation |
Cleaning position | Post cleaning |
Cleaning Speed | 10-200mm/sec |
Cleaning fuid consumption | Auto &Manually adjustable |
Cleaning paper consumption | Auto &Manually adjustable |
Vision Parameters | |
CCD FOV | 10*8mm |
Camera type | 130 Thousand CCDDigital camera |
Camera System | Lock up/down optics structure |
Camera Cyde time | 100ms |
Fiducial mark types | Standard Fiducial Mark Shape |
round,square,diamond、cross | |
Pad and profile | |
Mark size | 0.1-6mm |
Mark number | Max:4pcs |
Stay away number | Max:1pcs |
Machine parameter | |
Power Source | AC:220±10%,50/60Hz 2.2KW |
Air Pressure | 4~6Kgf/cm2 |
Air Consumption | about 5L/min |
Operating Temperature | -20℃~+45℃ |
Working environment humidity | 30%~60% |
Machine dimension (without Tower Ight) | 1240(L)mm*1410(W)mm*1500(H)mm |
Machine Weight Approx | Approx 1100Kg |
Equipment load bearing requirements | 650Kg/m |