1. Zenith system can perform full 3D inspection on components, patterns, holes and even foreign objects on mounted PCBs, and realize true 3D measurement, solving the shortcomings of 2D inspection technology.
2. Detect various defects, missing parts, offset, rotation, polarity, reverse parts, OCV/OCR, sideways, tombstones, micro-warping, empty soldering and bridging, etc.
3. KY’s unique ability to compensate for board bending can minimize the impact of PCB board bending on 3D AOI inspection.
4. Fast and simple detection condition setting, by quantifying the detection results, eliminates the uncertainty of the detection process
Model | L | XL | ||
Single Lane | Dual Lane | Single Lane | Dual Lane | |
Max.PCB Size (XxY) | 490×510 mm (19.29×20.01in) | Single Mode | 690×690 mm (27.17×27.17 in) | Single Mode |
490×580 mm (19.29×22.83 in) | 690×580 mm (27.17×22.82 in) | |||
Dual Mode | Dual Mode | |||
490×320 mm (19.29×12.60 in) | 690×320 mm (27.17×12.60 in) | |||
Min.PCB Size | 50×50 mm(1.97×1.97 in) | |||
PCB Thickness | 0.4~5mm(0.02~0.2 in) | 0.4~8mm(0.02~0.31in) | ||
Max.PCB Weight | 4kg(8.82 lbs) | 10kg(22.05 Ibs) | ||
Machine Weight | 600kg (1322.77 Ibs) | 700kg (1543.24Ibs) | 750kg(1653.47 Ibs) | |
Bottom Clearance | 50mm(1.97 in) | |||
Supplies | 220 Vac±10%,1 Phase,50/60 Hz,5Kgf/cm²(0.45Mpa) | |||
W | 1000 mm(39.37 in) | 1200 mm(47.25 in) | ||
D | 1295mm(50.98 in) | 1475 mm(58.07 in) | 1475mm(58.07 in) | |
H | 1627 mm(64.06 in) |
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