SMT Online 3D SPI MR-S400/S510/S510D – Dongguan Mingrui Technology Co., Ltd.

❙ Introduce of SMT Online 3D SPI MR-S400/S510/S510D

Introduction

3D SPI can completely solve the problem of shadow and random reflection in the detection process, so that solder paste 3D detection accuracy is higher; equipped with a 12M pixel high-speed camera, detection speed is faster, the image is more delicate and rich; it is an ideal choice for high-speed and high-precision production lines.

Features

The lens of professional lens design makes the image more uniform and delicate, and greatly improves the stability of detection.

2.It can be imported into Gerber file programming, or can be used to edit and debug money from image editing mode.

3.The multi direction 3D projection method can effectively solve the detection error caused by the shadow effect in the solder paste detection process.

4.The operation system improves the result recognition and processing function according to the user level interface structure.

High precision programmable black and white moire fringe, the highest measuring accuracy 0.67um.

6.Based on accurate 3 dimensional measurement data, operators can optimize the whole project in a short time.

❙ Specification of SMT Online 3D SPI MR-S400/S510/S510D

	Model	MR-S400	MR-S510	MR-S510D
Measurement System	PCB Size	5555 ~400400mm	5555 ~510460mm	400300mm2（Dual-Lane) 400590mm（Single-Lane） (Optional ：510330mm*2）
	Rail Fixed	front fixed (back fixed as option)
	PCB Tickness	0.5 ~ 6.0mm
	PCB Weight	≤5.0kg
	Conveyor Adjustment	automatic
	Conveyor Height	900±20mm
	PCB Direction	Left ~ Right(Right ~ Left)
Software System	Measure Type	Height,Area,Volume,Offset,Bridge,Shape（missing print,insufficient tin, excessive tin, bridging, offset, mal-shapes, surface contamination）
	Paste Height	0 ~ 550um
	Accuracy	XY (Resolution):10um
	Repeatability Height	≤1um (4 Sigma), volume/acreage:<1%(4 Sigma)
	Min Pad Pitch	≥100um
	Measure Principle	3D white light PSLM PMP(Programmable Spatial Light Modulation, Phase Measurement Profilometry)
	Inspection Head Quanlity	1
	Camera Pixel	12MP（Optional: 5MP/21MP）
	Optical Resolution	5μm/10μm/15μm/20μm
	FOV Size	20mm15mm/40mm30mm/60mm*45mm
	Minimum Chip	0201
	Detection Speed	0.34s/FOV
Machine Direction	Language	English
	Program Mode	Off line or on line
	Program Time	5 ~ 10min
	Data Type	Gerber Data 274D/274X, Scan PCB
	SPC & Process Monitoring	Standard SPC
	Drive Mode	Servo Drive
Inspection Item	Inspection type	Height、Area、Dimension、Oﬀset、Shape
	Types of Defects Detection	Print leakage,insufficient solder,excess solder,solder-connection, Skew,odd-shaped,foreign material,Excess solder
Option	Power	AC200-230,50/60Hz,3KVA
	Air Pressure	0.4~ 0.6Mpa
	Machine Dimension	W1000D1150H1530mm
	Weight	965kg