❙ Introduce of  Vacuum Reflow Oven VH0813/VH1013

Features:

  1. Control System: Employs a PC + Siemens PLC control system, ensuring precise and stable temperature control with a temperature stability rate exceeding 99.99%.
  2. Vacuum System: The PCB board enters the vacuum unit directly from the soldering area. Upon initiation of the vacuum process, the vacuum pressure drops to 100mbar-5mbar. Gases from the pores inside the grounding pads and the gaps in the solder paste escape from the molten solder joints.
  3. Hot Air System: Utilizes a top-tier heating module and optimized temperature zoning design to achieve optimal temperature uniformity and repeatability. Highly efficient utilization and thermal compensation ensure that the temperature stabilizes within less than 20 minutes, achieving a control accuracy of ±1℃ from ambient temperature.
  4. Monitoring Software: Windows interface with password-protected access control for easy operation. Features include operation logging, process monitoring, automatic generation and saving of process control documents, and dynamic display of substrate transfer.
  5. Cooling System: A brand-new cooling zone allows for quick and easy adjustment, easily meeting the cooling needs of different slopes;
  6. Temperature Protection: GDMR employs third-party over-temperature protection, with multiple layers of protection ensuring safe operation;
  7. Product complies with CE, CCC, UL, and other standards and specifications;
  8. User-friendly Design: Fault detection (such as heater malfunction alarms), regular maintenance reminders, economical functions, and tool-free maintenance reduce equipment failure rates;
  9. Heating Module: The horizontal reflow soldering design ensures that temperatures in each zone do not affect each other, ensuring accurate temperature profiles while guaranteeing high throughput and heat exchange capacity, achieving high adaptability (meeting the welding needs of automotive, communication, electronics, computer, mobile phone, and consumer electronics products);
  10. The hot air motor uses independent frequency conversion control, allowing the operating frequency to be set according to different processes, meeting the requirements of various lead-free soldering processes;
  11. Key Components: Imported key components ensure smooth equipment operation and reduce maintenance costs;
  12. Standard flux recovery system ensures furnace cleanliness.

Nitrogen and online temperature monitoring system (SPC) are optional.

❙ Specification of  Vacuum Reflow Oven VH0813/VH1013

No.

Item

VH0813

VH1013

1

Dimension

L6400*W1695*H1650

L7170*W1695*H1650

2

Weight

3000KG

3500KG

3

Number of heating zone

Top 8 /Bottom 8

Top10 /Bottom 10

4

Length of heating zone

3110mm

3892mm

5

Number of cooling zone

Top 3 /Bottom 3

Top 3 /Bottom 3

6

Exhaust volume requiement

11m³/min*2

12m³/min*2

7

Power

3phase, N,PE;AC380V50/60HZ

3phase, N,PE;AC380V50/60HZ

8

Total power

67KW

83KW

9

Startup power

32KW

38KW

10

Normal power consumption

10KW

12KW

11

Warming Time

Approx:20min-25min

12

Temperature control range

Room temperature -300℃

13

Temperature control Mode

PID close loop cont+SSR driving

14

Temperature control precision

±1℃

15

Temperature deviaation on PCB

±1℃

 

Conveyor system

16

Rails structure

Three-stage independent

17

Max width of PCB

150*150MM-400*400MM

18

Range of rail width

50mm-400mm

19

Components height

Up 30mm/down 30mm

20

Conveyor direction

L-R

21

Conveyor fixed type

Front end fixing

22

PCB conveyor direction

Guide rail plus chain

23

Conveyor height

900±20mm

24

Conveyor speed

300mm-2000mm

25

Auto-lubrication

Can set a variety of automatic or manual filling high temperature lubricating oil

 

Vacuum chamber transport

26

Width modulation

Three-stage synchronous width adjustment

27

Vacuum chamber mode of transport

Independent transport

28

Ultimate vacuum

50PA

29

Vacuum extraction method

Four-stage independent vacuum

 

Cooling system

 

30

 

Cooling method

Forced air cooling (vacuum reflow soldering)

Chiller cooling (vacuum nitrogen reflow soldering)

Options

31

Nitrogen System

Nitrogen confined structures and pipelines, nitrogen flow meters, chillers

32

Anti-stuck structure

No affects by PCB thickness, no manually adjusting to solder products of different thickness, 1mm-2mm-3mm can be soldered