❙ Introduce of BGA Rework Station BR-1250

  Features:

1. Seven independent axes, driven by seven motors. Joystick control for upper and lower temperature zones, PCB movement, and X/Y movement of the optical alignment system are all simple to operate. A memory function improves efficiency and automation for batch rework.
2. The integrated heating and placement head design features automatic rotation, alignment, soldering, and removal.
3. The upper head utilizes a dual-channel hot air heating system with a large airflow design, ensuring uniform temperature at all corners when reworking large components. It also boasts rapid, uniform heating and cooling (with a 50-80°C drop), meeting the requirements of lead-free soldering processes.
4. Three independent temperature zones (upper, lower, and infrared preheating) are synchronized and automatically moved, allowing the upper and lower zones to automatically reach any position within the bottom infrared preheating zone.
5. The unique bottom infrared preheating platform utilizes high-quality heating materials imported from Germany (infrared gold-plated light tubes) and anti-glare constant-temperature glass (temperature resistant up to 1800°C), providing a preheating area of ​​630 x 500mm.
6. The preheating platform, clamping plate, and cooling system automatically move in the X-axis, making PCB positioning and desoldering safer and more convenient.
7. The X- and Y-axis movement and unique overall design fully utilize the equipment space, enabling rework of extremely large PCB areas with a relatively small footprint.
8. The clamping plate is equipped with a positioning scale, and the system can remember past positioning scales, making repeated positioning more convenient and faster.
9. Built-in vacuum pump, Φ-axis rotation with arbitrary angles, high-precision stepper motor control, automatic memory function, and precise nozzle adjustment for placement.
10. The nozzle automatically detects the material pickup and placement height, and the pressure can be controlled within a small range of 10 grams, enabling zero-pressure pickup and placement, suitable for smaller chips.
11. Color high-definition optical vision system with dual-color spectrometry, magnification, and fine-tuning functions, including a color difference resolution device, autofocus, software-operated functions, 22x optical zoom, and a maximum component size of 120*120mm for rework.
12. Temperature control breaks new ground with conventional on-off control. Embedded industrial computer with touchscreen human-machine interface. PLC control, real-time temperature curve display, displaying both set and measured curves, and analysis of measured curves.
13. 10 ramp-up (ramp-down) and 10 constant temperature control levels, with massive temperature curve storage and on-screen analysis.
14. Various alloy hot air nozzles in various sizes, easily replaceable, with 360° rotation and positioning.
15. Equipped with five temperature measurement ports, it provides multi-point real-time temperature monitoring and analysis.
16. Equipped with a nitrogen inlet, it supports external nitrogen-shielded soldering, making rework safer and more reliable.
17. Automatic chip placement and removal is achieved using a fixture with a positioning scale. Simply enter the chip size on the operation screen, and the upper air nozzle will automatically capture the center of the chip, making it more suitable for mass production.

❙ Specification of BGA Rework Station BR-1250