❙ Introduce of BGA Rework Station BR-750

1. Features:

   1. The machine adopts a touch screen human-machine interface. The heating time, heating temperature, heating speed, cooling time, early alarm, vacuum time, etc. are all set on the touch screen. The operation is intuitive, simple and easy to use.
   2. This machine utilizes an imported Japanese Panasonic PLC and a Dalian University of Technology temperature control module for independent control. It displays three temperature curves at any time and features four independent temperature measurement interfaces, enabling accurate temperature determination at multiple locations on the chip, ensuring chip soldering yield.
   3. Three independent heating zones are independently controlled, each with its own adjustable heating temperature, heating time, and ramp rate. Six heating stages simulate reflow soldering, allowing for settings for preheating, holding, ramping, soldering, reflow, and cooling.
   4. This machine features automatic feeding, feeding, and unloading functions, and can automatically identify the chip’s center position during alignment.
   5. Multi-functional mode selection includes four modes: soldering, unloading, placement, and manual, offering both automatic and semi-automatic functionality to meet diverse customer needs.
   6. Using high-precision K-type thermocouples imported from the United States for closed-loop control and our unique heating method, we guarantee a soldering temperature differential of ±1°C. 7. This machine utilizes an imported optical alignment system and is equipped with a 15-inch high-definition monitor. High-precision micrometers are used for X/Y/R axis adjustment, ensuring alignment accuracy within 0.01-0.02mm.
   7. To ensure precise alignment, the upper heating head and placement head are integrated. The machine is equipped with various BGA heating nozzles to better meet customers’ diverse chip needs. The nozzles are easily replaceable and can be customized for specific requirements.
   8. Automation and high precision completely eliminate human error, achieving optimal results for rework of lead-free and double-layer BGAs, QFNs, QFPs, capacitors, resistors, and other components.

❙ Specification of BGA Rework Station BR-750